We offer many different upgrades to GCA’s line of wafer steppers
H & L Associates PC upgrade of DEC Micro 11 systems.
• Remote terminal control of the stepper.
• Remote system software backup.
Off-line job specification.
Remote video troubleshooting using Pan/Tilt/Zoom (PTZ) camera with network video streaming capabilities.
• Ability to modify leveling software for small or odd shaped substrates.
• VT100 terminal replacement.
• USB flash drive support for existing PC upgrades for easy system
• Custom made chucks for unusually
thick, thin, or odd shaped substrates.
Interchangeable chuck system for the ability to do multiple substrates on one tool.
• Theta II and III leveling stages.
• Improved Alignment On Platen (AOP) functionality.
• Reticle Management System (RMS) reliability enhancements.
• CCD camera for global alignment system.
• Integrated Alignment System (IAS) / Automatic Wafer
Aligner – Digital (AWA-D).
alignment – both Dark Field Alignment System (DFAS) and MicroDFAS.
• Automatic Wafer Handler (AWH).
• Smart Set and electronics
that we have the ability, experience and knowledge necessary to customize many aspects of the stepper to your needs. If
you have an idea for something you’d like to see upgraded or added to the tool please let us know, and we’ll work
with you on making it happen.